4 PCS Silk Wire Deficiency Tin With Low Residue Strip BGA To Remove Tin Welding Strip Electronic Maintenance Welding Material, Model: CP-3015 3.0mm x 1.5m

4 PCS Silk Wire Deficiency Tin With Low Residue Strip BGA To Remove Tin Welding Strip Electronic Maintenance Welding Material, Model: CP-3015 3.0mm x 1.5m

1. Material: copper, plastic
2. Scope of application: suitable for cleaning soldering tin on PCB boards, etc.
3. It adopts flat needle weaving, soft design, fast heat conduction, suitable for fast tin sucking, improve work efficiency, and be more environmentally friendly
4. Fast tin absorption, low residue, used to absorb excess solder when removing tin, oxidation and corrosion resistance, good thermal conductivity and tin absorption performance, clean tin absorption
5. Width: 2/2.5/3/3.5mm
6. Length: about 1.5 meters/piece
7. Weight: about 7g/piece for 2mm, about 8g/piece for 2.5mm, about 9g/piece for 3mm, 10g/piece for 3.5mm

Steps for usage:
1. For the solder that you want to remove, put an appropriate length of the suction wire on the cleaned solder point, and then use the electric soldering iron nozzle to lightly heat it, and the solder will be sucked by the suction wire after the solder melts
2. When the solder is absorbed, remove the soldering iron and the suction wire at the same time
3. Cut off the used suction wire with cutting pliers